표제지
목차
국문요약 17
Abstract 18
1. 서론 및 이론적 배경 19
2. 문헌연구 22
2.1. 유전체 조성 및 기본 특성 22
2.2. 바륨 용출 특성 22
2.3. 주석 도금액에서 Glass 침식 유발물질 24
2.4. Passivation Layer 형성을 통한 BaTiO₃ 침식 방지 25
2.4.1. Barium Carbonate(BaCO₃) Passivation Layer 26
2.4.2. Barium Oxalate(BaC₂O₄) Passivation Layer 28
2.4.3. Barium Sulfate(BaSO₄) Passivation Layer 30
3. 연구 배경 32
4. 기술개발의 내용 34
4.1. Sn 도금액의 구성물질 35
4.2. 구성성분별 최적화 실험 37
4.2.1. 전도염 Methane Sulfonic Acid (MSA, 유기산)의 농도별 실험 37
4.2.2. 전도염 NaOH (수산화나트륨)의 농도별 실험 40
4.2.3. Complexing Agent (글루콘산나트륨) 의 농도별 실험 42
4.2.4. 침식방지제 (NaHSO₄) 의 농도별 실험 45
4.2.5. 침식방지효과 확인 실험 47
4.2.6. 계면활성제(PEG계) 농도별 실험 50
4.2.7. Grain Refiner (요소계 화합물) 농도별 실험 54
4.2.8. 변색방지제 농도별 실험 (Azole계 화합물) 56
4.3. 기존도금액과의 비교평가 61
4.3.1. Hull Cell Test 비교평가 62
4.3.2. 도금효율 비교 평가 64
4.3.3. 바렐도금 평가 69
4.3.4. Zero Crossing test 평가 72
4.4. 침식방지 평가 78
4.4.1. Glass powder 의 도금액 구성물질별 침식확인 78
4.4.2. Glass powder 의 도금액별 침식확인 79
4.4.3. 외부전극 침식확인 81
4.4.4. 외부전극 박리 테스트 82
4.5. 양산설비평가 83
4.5.1. CHIP SIZE 2012 (mm) 도금평가 85
4.5.2. CHIP SIZE 1608(mm) 도금평가 87
4.5.3. CHIP SIZE 0806 (mm) 도금평가 91
4.5.4. CHIP SIZE 1005 (mm) 도금평가 93
4.5.5. CHIP SIZE 1206/ 0805/ 0603 (mm) MLCC 도금평가 95
4.6. Steel Ball 뭉침 평가 96
4.7. 수명평가 98
4.8. 정전용량 변화율 평가 103
5. 결론 104
6. 참고문헌 106
Table. 2.1. Conductive and Complexing Agent Candidates and Components 25
Table. 4.1. The Role of Consisting Elements in Electrolyte 36
Table. 4.2. The Composition of Consisting Elements in each Electrolyte 36
Table. 4.3. Voltage Check in Hull Cell Test according to MSA Concentration 39
Table. 4.4. Voltage Check in Hull Cell Test according to NaOH Concentration 42
Table. 4.5. Voltage Check in Hull Cell Test according to Sodium Gluconate Concentration 44
Table. 4.6. Voltage Check in Hull Cell Test according to Corrosion Inhibitor Concentration 46
Table. 4.7. ICP Result after 24hr dipping in D.I Water 47
Table. 4.8. ICP Result after 24hr dipping in LW1 Plating Solution 48
Table. 4.9. ICP Result after 24hr dipping in Corrosion Inhibitor 10g/Lt Plating Solution 48
Table. 4.10. ICP Result after 24hr dipping in Corrosion Inhibitor 20g/Lt Plating Solution 49
Table. 4.11. ICP Result after 24hr dipping in Corrosion Inhibitor 30g/Lt Plating Solution 50
Table. 4.12. Voltage Check in Hull Cell Test according to Wetting Agent Concentration 52
Table. 4.13. Voltage Check in Hull Cell Test according to Grain Refiner Concentration 55
Table. 4.14. Voltage Check in Hull Cell Test according to Discolor Inhibitor Concentration 58
Table. 4.15. Optimized Plating Solution Concentration 61
Table. 4.16. Hull Cell Test Condition 62
Table. 4.17. Check Hull Cell Plating Thickness (XRF Result) 63
Table. 4.18. Efficiency Measurement Plating Conditions 65
Table. 4.19. Nickel Plating Condition 69
Table. 4.20. Sn Plating Condition 70
Table. 4.21. PCT, ZCT Method and Condition 72
Table. 4.22. Glass Powder Dipping Test by Plating Solution Components 78
Table. 4.23. Glass powder Dipping Test by Raw Materials 79
Table. 4.24. Size 2012 (mm) Plating Test Condition 85
Table. 4.25. Size 2012 (mm) Plating Thickness Result 85
Table. 4.26. Size 1608 (mm) Plating Thickness Result 87
Table. 4.27. Size 0806 (mm) Plating Test Condition 91
Table. 4.28. Size 1005 (mm) Plating Test Condition 93
Table. 4.29. Size 1206/0805/0603 (mm) Plating Test Condition 95
Table. 4.30. Size 1206/0805/0603 (mm) Plating Test Result 95
Table. 4.31. Steel Ball Twin Test Result 97
Table. 4.32. Life Time Test Condition 98
Table. 4.33. Measured Capacitances of MLCC prepared using LW-3 Electrolyte before and after the PCT 103
Fig. 1.1. Barium Elution Formula 20
Fig. 1.2. Crack Occurrence Overview 20
Fig. 1.3. Soldering Trouble Due to Crack 21
Fig. 1.4. IR Degradation 21
Fig. 2.1. Ba²⁺ Elution according to Ba/Ti Ratio 23
Fig. 2.2. Ba²⁺ Elution in the Dielectric according to pH 24
Fig. 2.3. Phase Diagram of BaTiO₃ according to pH 27
Fig. 2.4. Ba²⁺ Elution Tendency depending on the Type of Organic Material Additive 28
Fig. 2.5. Ba²⁺ Elution according to PVA Concentration 29
Fig. 2.6. Ba²⁺ Elution according to PAA Concentration 30
Fig. 2.7. BaSO₄ Elution according to pH (T= 200 ° F, Duration= 24h) 31
Fig. 4.1. Ba²⁺ Elution Rate by Plating Solution Components 35
Fig. 4.2. Hull Cell Test Method 37
Fig. 4.3. Appearance Change of Plating Solution according to MSA Concentration 38
Fig. 4.4. Hull Cell Test Results Based on MSA Concentration 39
Fig. 4.5. Appearance Change of Plating Solution according to NaOH Concentration 40
Fig. 4.6. Hull Cell Test Results Based on NaOH Concentration 41
Fig. 4.7. Appearance Change of Plating Solution according to Sodium Gluconate Concentration 43
Fig. 4.8. Hull Cell Test Results Based on Sodium Gluconate Concentration 44
Fig. 4.9. Appearance Change of Plating Solution according to Corrosion Inhibitor Concentration 45
Fig. 4.10. Hull Cell Test Results Based on Corrosion Inhibitor Concentration 46
Fig. 4.11. Appearance Change of Plating Solution according to Wetting Agent Concentration 51
Fig. 4.12. Hull Cell Test Results Based on Wetting Agent Concentration 52
Fig. 4.13. Morphology according to Wetting Agent 53
Fig. 4.14. Appearance Change of Plating Solution according to Grain Refiner Concentration 54
Fig. 4.15. Hull Cell Test Results Based on Wetting Agent Concentration 55
Fig. 4.16. Morphology according to Grain Refiner 56
Fig. 4.17. Appearance Change of Plating Solution according to Discolor Inhibitor Concentration 57
Fig. 4.18. Hull Cell Test Results Based on Discolor Inhibitor Concentration 58
Fig. 4.19. Reflow Test Results Based on Discolor Inhibitor Concentration 60
Fig. 4.20. Hull Cell Test Result Picture 63
Fig. 4.21. Morphology SEM Picture (x1.0k) 64
Fig. 4.22. Efficiency Measurement Method 65
Fig. 4.23. Plated Specimen after Plate Plating 66
Fig. 4.24. SEM Picture after Plate Plating 66
Fig. 4.25. Voltage by Current Density during Plate Plating 67
Fig. 4.26. Efficiency Measurement by Current Density 68
Fig. 4.27. Mini Barrel Plating Equipment 69
Fig. 4.28. SEM Picture of Sn Deposition Surface 70
Fig. 4.29. Sn Deposition Surface after 3 times Reflow 71
Fig. 4.30. Wetting Balance Method 73
Fig. 4.31. LW-1 Plating Solution ZCT TEST Result 74
Fig. 4.32. LW-3 Plating Solution ZCT TEST Result 77
Fig. 4.33. Glass Powder Dipping Test by LW-1 80
Fig. 4.34. Glass Powder Dipping test by LW-3 80
Fig. 4.35. Cross-sectional Photograph of Outer Electrode after Dipping in LW-1 plating solution 81
Fig. 4.36. Cross-sectional Photograph of Outer Electrode after Dipping in LW-3 plating solution 81
Fig. 4.37. Outer Electrode Peeling Test 82
Fig. 4.38. Mass Plating Equipment 84
Fig. 4.39. Size 2012 (mm) Plating Test 86
Fig. 4.40. Size 1608 (mm) Plating Test 90
Fig. 4.41. Size 0806 (mm) Plating Test 92
Fig. 4.42. Size 1005 (mm) Plating Test 94
Fig. 4.43. Steel Ball Twin Test Result 97
Fig. 4.44. 0.5ASD Life Time Test Result 100
Fig. 4.45. 1.0ASD Life Time Test Result 102