표제지
목차
Contents 7
국문요약 13
Abstract 14
1. 서론 15
2. 이론적 배경 16
2.1. 전자 패키지 연구 동향 16
2.2. 유연 전자기기 연구 동향 20
2.3. 솔더링 20
2.3.1. 금속간화합물 21
2.4. 무연 솔더 21
2.4.1. 납 사용 규제 21
2.4.2. 무연 솔더의 종류 및 특성 22
2.4.3. 나노입자 첨가를 이용한 Sn-58Bi 솔더 강화 25
2.5. PCB 표면처리 27
2.5.1. HASL 27
2.5.2. Immersion Sn 27
2.5.3. OSP 27
2.5.4. ENIG 28
2.5.5. ENEPIG 28
2.6. 기계적 특성 평가 28
2.6.1. 볼 전단 시험 28
3. 실험 방법 30
3.1. 솔더 페이스트 30
3.2. PCB 기판 제작 33
3.3. 솔더볼 형성 33
3.4. 볼 전단 시험 36
3.5. 단면 관찰 36
3.6. 파면 관찰 36
4. 실험 결과 및 고찰 38
4.1. 솔더 내부 미세조직 관찰 38
4.2. OSP 표면처리에 따른 계면 반응 및 기계적 특성 41
4.2.1. 계면 반응 41
4.2.2. 기계적 특성 44
4.3. ENIG 표면처리에 따른 계면 반응 및 기계적 특성 50
4.3.1. 계면 반응 50
4.3.2. 기계적 특성 53
4.4. ENEPIG 표면처리에 따른 계면 반응 및 기계적 특성 59
4.4.1. 계면 반응 59
4.4.2. 기계적 특성 62
4.5. 표면처리별 비교 68
5. 결론 70
6. 참고문헌 72
Table. 1. Condition of composite solder fabrication. 32
Fig. 1. Packaging technology roadmap. 18
Fig. 2. System semiconductor roadmap. 19
Fig. 3. Sn-Bi binary phase diagram. 24
Fig. 4. Sn-Bi-Ag ternary phase diagram. 26
Fig. 5. (a) Schematic diagram for Fabrication of composite solder (b)... 31
Fig. 6. (a) Schematic diagram for Screen printing and reflow process (b)... 34
Fig. 7. Temperature profile of reflow process. 35
Fig. 8. (a) Schematic diagram for ball shear test (b) low speed shear test... 37
Fig. 9. Cross-sectioned SEM images of composite solder microstructure after reflow. 39
Fig. 10. Distance between Bi phases after reflow. 40
Fig. 11. Cross-sectioned SEM images of composite solder joint with OSP finish after reflow. 42
Fig. 12. Thickness of total IMC at composite solder joint... 43
Fig. 13. Mechanical properties of composite solder joint with OSP finish... 45
Fig. 14. Fractured-surface SEM images of composite solder joint with OSP finish after low speed shear test. 47
Fig. 15. Fractured-surface SEM images of composite solder joint with OSP finish after high speed shear test. 48
Fig. 16. Ratio of IMC area with OSP finish after high speed shear test. 49
Fig. 17. Cross-sectional SEM images of composite solder joint with ENIG finish after reflow. 51
Fig. 18. Thickness of total IMC at composite solder joint... 52
Fig. 19. Mechanical properties of composite solder joint with ENIG finish... 54
Fig. 20. Fractured-surface SEM images of composite solder joint with ENIG finish after low speed shear test. 56
Fig. 21. Fractured-surface SEM images of composite solder joint with ENIG finish after high speed shear test. 57
Fig. 22. Ratio of IMC area with ENIG finish after shear test (a) low speed... 58
Fig. 23. Cross-sectional SEM images of composite solder joint with ENEPIG finish after reflow. 60
Fig. 24. Thickness of total IMC at composite solder joint... 61
Fig. 25. Mechanical properties of composite solder joint with ENEPIG... 63
Fig. 26. Fractured-surface SEM images of composite solder joint with ENEPIG finish after low speed shear test. 65
Fig. 27. Fractured-surface SEM images of composite solder joint with ENEPIG finish after high speed shear test. 66
Fig. 28. Ratio of IMC area with ENEPIG finish after shear test (a) low... 67
Fig. 29. Properties with various substrate after 9 times reflow (a) force... 69