In this paper, a 3D modeler for flatting of wafer-stage is developed. This researched modeler show the perspective view, intersected view and plane figure of measured wafer-stage. We can simulate polishing work for given wafer-stage on this modeler too. This Modeler generate the result of polishing control signal and store it into a file for real working.
Simulation results show that the 3D modeler provider shorter product time then previous handling time for flatting works.