Title page
Abstract
Contents
I. Introduction 16
1.1. Classification of optical interconnections with the distance 16
1.2. Necessities of chip-to-chip optical interconnection 18
1.3. Chip-to-chip optical interconnections based on optical printed-circuit board 26
II. Architecture of optical interconnection based on the OPCB 28
2.1. Passively assembled optical interconnection 28
2.2. Optical analysis for the optical platform 37
2.2.1. Tolerance analysis by Ray optic simulation 37
2.2.2. Crosstalk analysis by Gaussian optic simulation 44
III. Design and fabrication of three optical components 52
3.1. Optical printed circuit board 52
3.1.1. Categorization of OPCBs and features 52
3.1.2. Fabrication process of FCEPCB 55
3.2. 90 -bent fiber block 60
3.3. Optical transmitter and receiver modules 65
3.3.1. Design of transmission lines on the module PCB and OPCB 65
3.3.2. Fabrication of the optical modules 71
IV. Experimental results 75
4.1. Optical link loss measurement 75
4.2. BER and eye diagram measurements 80
V. Conclusions 85
Appendix 87
국문요약 89
References 91
Acknowledgements 98
Table 1. Classification of optical interconnection with distance 17
Table 2. Specification condition of optic components used in the ray tracing simulation 38
Table 3. Categorization of OPCBs and features 54
Table 4. Parameters for design of transmission lines 67
Table 5. Comparison with other works 86
Fig. 1. Expectation for increment of clock rate. 19
Fig. 2. Schematics for comparison of (a) optical and (b) electrical interconnections. 22
Fig. 3. A microstrip transmission line model. 23
Fig. 4. Simulated results about 3-dB bandwidth limited by attenuation and dispersion in the optical and electrical interconnection. 24
Fig. 5. Simulated results about frequency limited by 20-dB crosstalk in the optical and electrical interconnection. 25
Fig. 6. Architecture of the passively assembled optical interconnection platform. 29
Fig. 7. Detailed structures (a) having misalignments (V and H) occurred by self alignment function and (b) misalignments were absorbed into the tilted solder ball. 32
Fig. 8. Passive assembly process of the optical interconnection platform. 34
Fig. 9. Photograph of a completed interconnection platform using passive assembly technology. 35
Fig. 10. Photographs of the tilted solders absorbing the approximately 100-μm misalignment. 36
Fig. 11. Ray tracing simulation result using LightTools simulator. 40
Fig. 12. Misalignment tolerance analysis results at each interface. 42
Fig. 13. Misalignment tolerance analysis results under the actual condition. 43
Fig. 14. Parameters for (a) centered Gaussian beam and (b) decentered Gaussian beam. 46
Fig. 15. Cross-sectional view representing a PD and decentered Gaussian beams emitted from fiber array. 48
Fig. 16. Simulated crosstalk received at a PD. 50
Fig. 17. BER calculated from the received power in the own channel and the crosstalk. 51
Fig. 18. Fabrication process of FCEPCB. 57
Fig. 19. Photography of the fabricated FCEPCB. 58
Fig. 20. Photography of the splitter-type FCEPCB. 59
Fig. 21. Fabrication process of 90 -bent fiber block. 62
Fig. 22. Photography of 90-bent fiber block (a) 1 12 fiber array and ROC of 1.5~2 mm (b)2 12 fiber array and ROC of 3~3.5 mm. 63
Fig. 23. Measured insertion loss versus 90 -bent radius. 64
Fig. 24. Geometries of (a) single-ended microstrip line and (b) coupled microstrip lines. 66
Fig. 25. Transmission lines on (a) the module PCB and (b) the OPCB. 68
Fig. 26. Simulation results (S11 and S21) of transmission lines on (a) the module PCB and (b) the OPCB, and (c) a simulated eye diagram. 70
Fig. 27. (a) Draft and (b) photography of TX and RX module. 72
Fig. 28. Measured eye diagrams for each channel at 10 Gb/s/ch. 73
Fig. 29. Measured BER for each channel at 10 Gb/s/ch. 74
Fig. 30. Total link schematics that (a) IMO is filled and (b) IMO is unfilled. 78
Fig. 31. Measured optical power at each position in the optical link, about the case of (a) with IMO and (b) without IMO. 79
Fig. 32. (a) Experimental setup for the BER measurement and (b) photography of 8 Gb/s BER experiment with the crosstalk channels. 82
Fig. 33. Measured BER results along the data rate with electrical crosstalk and without electrical crosstalk. 83
Fig. 34. Measured eye diagrams of (a) 7 Gb/s without electrical crosstalk and (b) with electrical crosstalk, and (c) 8 Gb/s without electrical crosstalk and (d) with electrical 84
Fig. 35. 2D optical interconnection components; (a) OPCB, (b) 90 -bent fiber block, and (c) Tx and Rx modules. 88